![]() However, it is not a dedicated metal etcher (it does not do a post-etch water rinse to remove trapped chlorine that may continue to attack the metal).īest for Depositing dielectrics and etching both dielectrics and metals ![]() The etch chamber of the Oxford-100 is able to etch dielectrics and certain metals. For other dielectrics, the sts- CVD is an equivalent tool, but the Oxford-100 has lower pinhole densities. For dielectric deposition, this is the only RED tool that can deposit TEOS. The deposition can take place at low and high frequencies (similar to sts- CVD), allowing stress-balancing of deposited films. It can deposit silicon dioxide, nitride, SiC, a-Si, and TEOS. The Oxford-100 is a dual chamber plasma etch and deposition tool.
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